Parallel lines of misprint on the substrate.
– Gears not meshing together correctly;
– Butt-cut dies, sheeter dies and rectangle dies hitting hard against the substrate or anvil sending a shock wave through the press.
– Adjust overall plate package thickness to pitch line;
– Use as many idler rollers as possible, with as much wrap as possible, in the area between the die station and the print decks. Use a dense adhesive backing foam in the die cavities especially while running lower die pressures.